Vacuum Plasma Cleaner
Vacuum plasma cleaning machine is widely used in various industries due to the breakthrough of pressure plasma technology and the application of RF low-temperature plasma technology, especially in the microelectronics industry, which makes cleaning faster and more convenient. The plasma cleaning process does not produce pollution. The process is safe, environmentally friendly, green and innovative. It can save a lot of water, manpower and sulfuric acid. The principle of the vacuum plasma processor is to use the reactive oxygen groups in the plasma to react with the photoresist to generate carbon dioxide and water. The surface of the substrate can also be modified by using a large number of electrons and ions in the plasma to modify the surface of the substrate. Wettability and roughness.
Traditional wet cleaning methods are chemical cleaning methods: such as ammonia hydroxide / hydrogen peroxide to remove particles and organic substances on the surface of silicon wafers; hydrochloric acid / hydrogen peroxide to remove surface metals; hydrofluoric acid to remove the surface natural oxide layer; sulfuric acid / hydrogen peroxide to remove Surface metals and organics.
View more vacuum siliencers at www.labideal.com.
